DENKA

Product Information

DENKA THERMALLY CONDUCTIVE SPACER (Flexible Silicon Sheet)

Product Information

Outline

A material of high thermal conductivity (low heat resistance) made by filling silicon with a high content of our ceramic fillers. It offers great adhesion to uneven surface of electronic parts such as CPUs and MPUs, and transfers the heat to heat-sinks efficiently.

Characteristics

Characteristic products have been developed through careful selection of a filler and combination techniques. With these products, materials can be selected according to applications and purposes such as high thermal conductivity and high flexibility.

Applications

- PCs (MPU, chipset)
- Digital home appliances (IC)
- Power source

Related Information

Catalog

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Electronics & Innovative Products

Heat-Dissipating Materials G
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+81-3-5290-5542
FAX
+81-3-5290-5289
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