DENKA THERMALLY CONDUCTIVE SPACER (Flexible Silicon Sheet)
Product Information
Outline
A material of high thermal conductivity (low heat resistance) made by filling silicon with a high content of our ceramic fillers. It offers great adhesion to uneven surface of electronic parts such as CPUs and MPUs, and transfers the heat to heat-sinks efficiently.
Characteristics
Characteristic products have been developed through careful selection of a filler and combination techniques. With these products, materials can be selected according to applications and purposes such as high thermal conductivity and high flexibility.
Applications
- PCs (MPU, chipset)
- Digital home appliances (IC)
- Power source
Related Information
Catalog
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