DENKA THERMALLY CONDUCTIVE SPACER (Grease Type)
Product Information
Outline
A heat dissipation material of high thermal conductivity, suited for heat radiation of electronic parts of high heat generation density such as MPUs and ICs
Characteristics
A non-conventional material with high thermal conductivity, offering excellent heat dissipation performance as it will be stuck well to the other sided substrates
Applications
- PCs (MPU, chipset)
- Power modules (power source)
- Automobiles
Related Information
Catalog
- It is the customer’s responsibility to always test products before use and confirm their fitness for purpose and safety.
- Any product contained on this Website or any product using a product contained on this Website should be disposed of in accordance with laws and regulations.
- Before use, please confirm the detailed method of use, precautions, and other information by using the technical documentation and Material Safety Data Sheet. These materials are available from the relevant Division. Please request them.
- The information contained in this website is subject to change without notice as new knowledge becomes available.