DENKA ALSINK (Al-Diamond MMC type)
Product Information
Outline
"DENKA ALSINK(Al-Diamond MMC type)" is composites consisting of aluminum and diamond, and is very good material with low thermal expansion, high thermal conductivity (>500W/m K), high strength and light weight. Great attention is being paid to this products for heat sink member of GaN semiconductor chip.
Characteristics
- Lightweight: 1/3 weight of the copper base board
- 500W/m K : Copper base plate par or more high thermal conductivity.
- Ideal for heat dissipation of GaN semiconductor.
- The best Alternative of copper-alloy material(Cu/W, Cu/Mo etc), it is expected even higher performance.
Uses
Medical device, heat dissipation element of high frequency device for communication satellite
Feature
1. Representative values of physical properties
2. Comparison table between Al-Diamond MMC type and competing heat sink materials
- It is the customer’s responsibility to always test products before use and confirm their fitness for purpose and safety.
- Any product contained on this Website or any product using a product contained on this Website should be disposed of in accordance with laws and regulations.
- Before use, please confirm the detailed method of use, precautions, and other information by using the technical documentation and Material Safety Data Sheet. These materials are available from the relevant Division. Please request them.
- The information contained in this website is subject to change without notice as new knowledge becomes available.
