Product Information

DENKA ALSINK (Al-Diamond MMC type)

Product Information


"DENKA ALSINK(Al-Diamond MMC type)" is composites consisting of aluminum and diamond, and is very good material with low thermal expansion, high thermal conductivity (>500W/m K), high strength and light weight. Great attention is being paid to this products for heat sink member of GaN semiconductor chip.


  • Lightweight: 1/3 weight of the copper base board
  • 500W/m K : Copper base plate par or more high thermal conductivity.
  • Ideal for heat dissipation of GaN semiconductor.
  • The best Alternative of copper-alloy material(Cu/W, Cu/Mo etc), it is expected even higher performance.


Medical device, heat dissipation element of high frequency device for communication satellite


1. Representative values of physical properties

Item Typical data
Diamond content (Vol%) 57
Density (g/cm3) 3.17
Thermal conductivity (W/mK) 500
Specific heat (J/g・K) 0.62
Coefficient of thermal expansion (10-6/K) 7.5
Flexural strength (MPa) 300
Young’s modulus (GPa) 340
Melting point (℃) 570

2. Comparison table between Al-Diamond MMC type and competing heat sink materials

Thermal conductivity
Coefficient of thermal expansion
Al-Diamond ≧500 7.5 OK
Cu 390 17 Very good
Mo 159 5.1 Good
W 167 4.5 medium
Al-SiC 160~250 5~9 medium
Cu/Mo(85%) 160 7.0 medium
Cu/Mo/Cu(30) 210 7.2 medium
Cu/W(85%) 190 7.2 medium
Super CMC 260~370 6.5~10 medium

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