DENKA FUSED SILICA (DF) SPHERICAL TYPE-FINE CUT
In addition to EMC applications, coarse-particle cut-type are available for liquid sealants, such as underfill or potting applications. It is also available for mold underfill and resin substrates.
Fine cut types enable low viscosity and high content in liquid type resines, Available cut points are 30, 20 and 10 micrometer. On top of standard types, low uranium (low alpha ray) types are available for memory packages. They will be available for various applications and resins.
- Liquid type sealants
- Mold Underfill
- Various types of resin fillers
- Resin substrates
- Narrow-gap applications
Electronics & Innovative Products
Advanced Specialty Materials Dept.
- It is the customer’s responsibility to always test products before use and confirm their fitness for purpose and safety.
- Any product contained on this Website or any product using a product contained on this Website should be disposed of in accordance with laws and regulations.
- Before use, please confirm the detailed method of use, precautions, and other information by using the technical documentation and Material Safety Data Sheet. These materials are available from the relevant Division. Please request them.
- The information contained in this website is subject to change without notice as new knowledge becomes available.