DENKA THERMALLY CONDUCTIVE SPACER (Phase Change Sheet Type)
Product Information
Outline
A heat-dissipation material made by filling thermoplastic resins with a high content of ceramic filler
Characteristics
Excellent low thermal resistance can be obtained through great adhesion to parts by specific-temperature softening process
Applications
- PCs (MPU, chipset)
- FPDs (flat panel display)
- Driver ICs
Related Information
Catalog
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