So far advanced, it leaves the other competitors in the dust
Aluminum nitride is a key material for high thermally conductive substrates and packaging materials in the fields of power transistor modules and high-frequency (microwave) semiconductors, which require high insulation and high heat radiation.
DENKA has developed AN PLATE on the basis of nitriding and sintering technologies which have been fostered in ceramics development such as boron nitride and silicon nitride and metal-substrate production technology which also have been achieved in the commercialization of HITT plates.
Our total production/control system from the raw material (AlN powder) through copper bonding has enabled us to realize the highest quality and cost performance ever seen in the market.
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