Insulated Thermally Conductive Metal Circuit Board DENKA HITT PLATE Progress is currently being made in the area of power hybrid ICs and substrates in terms of miniaturization, higher degrees of integration, and higher power. These substrates require a higher degree of heat radiation as well as higher reliability and processing power than their predecessors. DENKA has released a series of products with high thermal conductivity, "DENKA BN THERMALLY CONDUCTIVE PLATE", "DENKA THERMALLY CONDUCTIVE SHEET", as well as "RAMDITE" a compound with high thermal-conductivity. "DENKA HITT PLATE" is a metal Circuit Board with high thermal-conductivity for SMT, which DENKA has developed using our high thermal-conductor technologies. "DENKA HITT PLATE" has a leading market position because of its high thermal conductivity and high reliability. Standard Specifications Features Application Examples UL Regulations New Product Information General characteristics of thermally conductive dielectric layer (typical values)