DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division
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- Classification by application
You can search DENKA electrical material products by application
Heat dissipation/Cooling
Dissipating heat from CPUs and power devices
High thermal-conductivity aluminum substrates
Heat resistant, corrosion resistant, wear resistant ceramics (Si3N4, Silicon Nitride)
Coarse particle cut type, fused silica powder
High thermal conductivity ceramic substrate (aluminum nitride)
A high thermal conductivity ceramic substrate (silicon nitride)
An aluminum-based composite (MMC) composed of Al-SiC (aluminum silicon carbide) and ceramics.
An insulated thermally conductive sheet with excellent thermal conductivity, electrical insulation and flame retardance
A pad-type thermally interface material having both excellent thermal conductivity and flexibility
A high-thermal conductivity adhesive sheet developed by combining DENKA’s proprietary polymer design and filler mixing design
Packaging
Materials used as sealing agents or mixing agents in IC packages
Spherical type alumina power with high thermal conductivity
High-temperature lubricant, thermally conductive, high-temperature corrosion resistant materials (Boron nitride, BN)
Transportation of electronic components
Used for transportation of electronic components during assembly
Conductive sheet for embossed carrier tape
Transparent sheet for embossed carrier tape
Cover tapes
Semiconductor machining
Used to cut and machine semiconductor components, silicon ingots, and glass materials
Dicing tape
Cut type of submicron-size spherical silica coarse particles
Other applications
Applied in various purposes other than those listed above
Temporary fixing adhesives for machining processes (cutting, grinding and polishing, and surface protection)
Electron source (LaB6 cathode)
Ion source for focused-ion beam (FIB) equipment
Electron source for electron microscopes (SEM, TEM)
Insulator, thermally conductive, high temperature corrosion resistant materials (Boron nitride, BN)
Wear resistant materials, movable components of precision machines, etc.
Spherical type amorphous silica powder with low thermal expansion
Ultra-Fine spherical particle silica powder
Second-generation acrylic adhesives (SGA)
Back grinding tape
UV light curing adhesives (Enethiol resin-based, acrylate)
High performance phosphors for LED module
