DENKA

Product Information

DENKA FUSED SILICA (DF) SPHERICAL TYPE-FINE CUT

Product Information

Outline

In addition to EMC applications, coarse-particle cut-type are available for liquid sealants, such as underfill or potting applications. It is also available for mold underfill and resin substrates.

Characteristics

Fine cut types enable low viscosity and high content in liquid type resines, Available cut points are 30, 20 and 10 micrometer. On top of standard types, low uranium (low alpha ray) types are available for memory packages. They will be available for various applications and resins.

Uses

  • Liquid type sealants
  • Mold Underfill
  • Various types of resin fillers
  • Resin substrates
  • Narrow-gap applications

Related Information

Contact Us

Electronics & Innovative Products

Advanced Specialty Materials Dept.
TEL
+81-3-5290-5541
FAX
+81-3-5290-5078
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