DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division
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- Classification by category
Products for which individual sections of our Electronic Products Department are responsible
Functional films
Used for transportation and pasting of electronic components during assembly
Conductive sheet for embossed carrier tape
Transparent sheet for embossed carrier tape
Cover tapes
Advanced filler
Used to control thermal expansion of IC-sealing resins
Coarse particle cut type, fused silica powder
Spherical type amorphous silica powder with low thermal expansion
Cut type of submicron-size spherical silica coarse particles
Spherical type alumina power with high thermal conductivity
Ultra-Fine spherical particle silica powder
Functional materials
Ceramic powder & molded parts mainly used for heat dissipation, Electron beam sources and phosphors
Heat resistant, corrosion resistant, wear resistant ceramics (Si3N4, Silicon Nitride)
High-temperature lubricant, thermally conductive, high-temperature corrosion resistant materials (Boron nitride, BN)
Electron source (LaB6 cathode)
Ion source for focused-ion beam (FIB) equipment
Electron source for electron microscopes (SEM, TEM)
Insulator, thermally conductive, high temperature corrosion resistant materials (Boron nitride, BN)
Wear resistant materials, movable components of precision machines, etc.
High performance phosphors for LED module
Electronic components
Circuit substrates, Heat dissipating products; etc.
High thermal-conductivity aluminum substrates
High thermal conductivity ceramic substrate (aluminum nitride)
A high thermal conductivity ceramic substrate (silicon nitride)
An aluminum-based composite (MMC) composed of Al-SiC (aluminum silicon carbide) and ceramics.
An insulated thermally conductive sheet with excellent thermal conductivity, electrical insulation and flame retardance
A pad-type thermally interface material having both excellent thermal conductivity and flexibility
A grease-type heat dissipation material realizing low thermal resistance
A heat-dissipation material realizing low thermal resistance through an improved contact between members by specific-temperature softening process.
A high-thermal conductivity adhesive sheet developed by combining DENKA’s proprietary polymer design and filler mixing design
Tapes and adhesives
Adhesives and tapes for electronic equipment
Second-generation acrylic adhesives (SGA)
UV light curing adhesives (Enethiol resin-based, acrylate)
Temporary fixing adhesives for machining processes (cutting, grinding and polishing, and surface protection)
Dicing tape
Back grinding tape
