DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division
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- Classification by characteristic
Products classified by the features of customer requirements
High thermally-conductive products
Products with excellent thermal conductivity for heat dissipation and cooling
High thermal-conductivity aluminum substrates
High thermal conductivity ceramic substrate (aluminum nitride)
A high thermal conductivity ceramic substrate (silicon nitride)
An aluminum-based composite (MMC) composed of Al-SiC (aluminum silicon carbide) and ceramics.
An insulated thermally conductive sheet with excellent thermal conductivity, electrical insulation and flame retardance
A pad-type thermally interface material having both excellent thermal conductivity and flexibility
A grease-type heat dissipation material realizing low thermal resistance
A heat-dissipation material realizing low thermal resistance through an improved contact between members by specific-temperature softening process.
A high-thermal conductivity adhesive sheet developed by combining DENKA’s proprietary polymer design and filler mixing design
Conductive products
Materials showing good electrical conductivity like metals
Conductive sheet for embossed carrier tape
Cover tapes
Insulation products
Products showing excellent insulation, for preventing electric current leakages from circuits
High thermal-conductivity aluminum substrates
High thermal conductivity ceramic substrate (aluminum nitride)
A high thermal conductivity ceramic substrate (silicon nitride)
An insulated thermally conductive sheet with excellent thermal conductivity, electrical insulation and flame retardance
Low thermal expansion products
Additive powder to IC sealing resins to reduce thermal expansion ratio
Coarse particle cut type, fused silica powder
Spherical type amorphous silica powder with low thermal expansion
Cut type of submicron-size spherical silica coarse particles
Ultra-Fine spherical particle silica powder
Optical scattering products
Additive powder to liquid/transparent resins to control light-scattering coefficient and reflective index
High performance phosphors for LED module
Easy-to-machine products
Ceramics and others applicable to precision machining
Conductive sheet for embossed carrier tape
Transparent sheet for embossed carrier tape
Other products
Products with more unique features than those listed above
Dicing tape
Electron source (LaB6 cathode)
Ion source for focused-ion beam (FIB) equipment
Electron source for electron microscopes (SEM, TEM)
Spherical type amorphous silica powder with low thermal expansion
Second-generation acrylic adhesives (SGA)
Temporary fixing adhesives for machining processes (cutting, grinding and polishing, and surface protection)
Back grinding tape
UV light curing adhesives (Enethiol resin-based, acrylate)
High performance phosphors for LED module
