DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division
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- DENKA THERMALLY CONDUCTIVE SPACER (Flexible Silicon Sheet)
DENKA THERMALLY CONDUCTIVE SPACER (Flexible Silicon Sheet)
A pad-type thermally interface material having both excellent thermal conductivity and flexibility
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Outline
A material of high thermal conductivity (low heat resistance) made by filling silicon with a high content of our ceramic fillers. It offers great adhesion to uneven surface of electronic parts such as CPUs and MPUs, and transfers the heat to heat-sinks efficiently.
Characteristics
Characteristic products have been developed through careful selection of a filler and combination techniques. With these products, materials can be selected according to applications and purposes such as high thermal conductivity and high flexibility.
Applications
- PCs (MPU, chipset)
- Digital home appliances (IC)
- Power source
- Digital home appliances (IC)
- Power source
Catalog
Contact
- Division
- Electronic Products Department, Electronic Materials Division
- Section
- Heat-Dissipating Materials G
- TEL
- +81-3-5290-5542
- FAX
- +81-3-5290-5289
