DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division

A high thermal conductivity and high-toughness ceramic substrate based on silicon nitride (Si₃N₄) having excellent mechanical properties and thermal conductivity about 4 times

- Thermal conductivity: about four times greater than alumina
- Mechanical properties: a substrate that has excellent mechanical properties, such as high fracture toughness and bending strength, and is durable under severe conditions involving rapid temperature changes
- Thermal expansion ratio: close to that of silicon

Comparison of physical properties and characteristic

- Power transistor module: for industrial machinery (machine tools, semiconductor manufacturing equipment, wind power generation, FA robots, etc.), electric railway