DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division
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- DENKA AN PLATE
DENKA AN PLATE
High thermal conductivity ceramic substrate (aluminum nitride)
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Outline
A high thermal conductivity ceramic substrate based on aluminum nitride (AIN) having thermal conductivity about seven times greater than that of alumina
Characteristics
- High thermal conductivity: 7 times greater than that of alumina
- High insulation performance: low dielectric constant, electric properties as good as those of alumina
- Mechanical properties: high strength equivalent to alumina
- Low thermal expansion ratio: close to that of silicon
So far advanced, it leaves the other competitors in the dust.
Aluminum nitride is drawing attention as a high thermal conductivity ceramic substrate and packaging materials in areas requiring high insulation and heat dissipating performance, such as power transistor modules and high frequency to microwave semiconductor circuits.
DENKA has developed AN PLATE using nitriding and sintering technologies acquired through the development of fine ceramics, such as boron nitride and silicon nitride, and metal substrate manufacturing technology acquired through the development of HITT PLATE.
DENKA AN PLATE is a high thermal conductivity ceramic substrate based on aluminum nitride having thermal conductivity several times greater than that of alumina. The product is available in various grades, mainly as ceramic circuit substrates for power modules requiring high thermal conductivity and electric strength, including a standard type (150 W/mK), a high thermal conductivity type (180 W/mK), a high-reliability type with high heat cycle resistance, and a thick, higher electric strength type.
Our total production/control system from the raw material (AIN powder) through copper bonding has enabled us to realize the highest quality and cost performance ever seen in the market.
- High insulation performance: low dielectric constant, electric properties as good as those of alumina
- Mechanical properties: high strength equivalent to alumina
- Low thermal expansion ratio: close to that of silicon
So far advanced, it leaves the other competitors in the dust.
Aluminum nitride is drawing attention as a high thermal conductivity ceramic substrate and packaging materials in areas requiring high insulation and heat dissipating performance, such as power transistor modules and high frequency to microwave semiconductor circuits.
DENKA has developed AN PLATE using nitriding and sintering technologies acquired through the development of fine ceramics, such as boron nitride and silicon nitride, and metal substrate manufacturing technology acquired through the development of HITT PLATE.
DENKA AN PLATE is a high thermal conductivity ceramic substrate based on aluminum nitride having thermal conductivity several times greater than that of alumina. The product is available in various grades, mainly as ceramic circuit substrates for power modules requiring high thermal conductivity and electric strength, including a standard type (150 W/mK), a high thermal conductivity type (180 W/mK), a high-reliability type with high heat cycle resistance, and a thick, higher electric strength type.
Our total production/control system from the raw material (AIN powder) through copper bonding has enabled us to realize the highest quality and cost performance ever seen in the market.
Features
General properties of AIN (representative values)
Product specifications and basic properties
Standard specifications
Applications
- Power transistor module: for industrial machinery (machine tools, semiconductor manufacturing equipment, wind power generation, FA robots, etc.), electric railway
- Power supply: Uninterrupted power supplies (UPS)
Light emitting diode (LED): Mounting substrate
- Automotive (HEV inverters)
- Power supply: Uninterrupted power supplies (UPS)
Light emitting diode (LED): Mounting substrate
- Automotive (HEV inverters)
Contact
- Division
- Electronic Products Department, Electronic Materials Division
- Section
- Heat-Dissipating Materials and Substrate G
- TEL
- +81-3-5290-5542
- FAX
- +81-3-5290-5289
