DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division
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- TEMPLOC
TEMPLOC
Temporary fixing adhesives for machining processes (cutting, grinding and polishing, and surface protection)
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Outline
TEMPLOC is a temporary fixing adhesive of a new era displaying high degree of breakthrough features. It has an adhesive strength equal to that of conventional thermoplastic cements (wax), hardens under UV light in a short period of time, and can be peeled off with hot water (recommended temperatures of 80 to 90 degrees Celsius) without using organic solvents.
Characteristics
- UV curable in shorter times
- Strong adhesiveness
- Environmentally friendly design enabling peel-off with hot water
- Strong adhesiveness
- Environmentally friendly design enabling peel-off with hot water
Applications
Cutting, grinding, polishing and surface protection of glass-related products.
Dicing and slicing of silicon wafers, and processing of other electronic members, etc.
Dicing and slicing of silicon wafers, and processing of other electronic members, etc.
Catalog
- TEMPLOC Brochure (JAPANESE ONLY)
(687KB)
Contact
- Division
- Electronic Materials Division
- Section
- Tape and Adhesive Department
- TEL
- +81-3-5290-5562
- FAX
- +81-3-5290-5289
