DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division

This is an ultra fine spherical silica particle produced using our proprietary manufacturing technologies. Our lineup includes products of submicron to nano-order levels, enabling high content filling for various types of resins, and a reduction in thermal expansion with an increase in dimensional accuracy can be expected. Can also be used for various types of surface treatment and as filler for surface improvement.

- Super Fine Powder (submicron silica) is suitable for reducing viscosity, increasing fluidity, and reducing flash in various types of resins and varnishes.
- Ultra Fine Powder (nano-order silica) has less cohesion (structure) than conventional fumed/precipitated silica, with excellent workability.

- Additive to increase fluidity and reduce flash in various types of resins (epoxy resins, etc.), such as semiconductor sealants
- Toner external additive materials
- Silicon rubber filling

- Sintering material and sintering agent
- Filler for liquid type sealants
- Various types of resin fillers
- Resin substrates
- Narrow-gap applications