DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division

This is spherical alumina having high globularity, developed by our proprietary high temperature melting technologies. Best suited as a filler intended to provide high thermal conductivity to various types of resins/rubbers and to increase their surface hardness. Grades with reduced ion-based impurities are also available, and it is also suited to the electronic material field for which reliability is required.

Easily filled with high content to various types of resins/rubbers, and can also control wear in kneading machines or molds compared with irregular-shaped fillers.. The particle distribution can be adjusted according to use. (particle diameter: 1–100 micrometer)

- Filler for semiconductor sealants
- Filler for various types of resin
* Best suited to improve the thermal conductivity and surface hardness of silicon rubbers, epoxy resins, various engineering plastics, etc.
- Powder to be laid for ceramic baking
- Grinding grit
- Spraying material