DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division

We provide a product line of submicron-size spherical silica coarse particles of the cut type developed by our unique manufacturing technologies. They come in a submicron level, and feature high-precision removal of particles and monodispersity through slurry technology. High content filling in thin-film resins aversive of particles is possible, and excellence in filling of narrow gaps, reduction in thermal expansion with increase in dimensional accuracy, can be expected. Applications such as various surface treatments and fillers for surface improvement are also possible.

These cut-type coarse particles of submicron-size spherical silica are available in the submicron level. One of the most significant characteristics is high-precision removal of particles and monodispersity by the slurry technology. High content filling in thin-film resins aversive of particles is possible, and excellence in filling of narrow gaps, decreased thermal expansion, as well as increased precision in dimensions can be expected. Applications such as various surface treatments and fillers for surface improvement are also possible.

- Filler for liquid type sealants
- Various types of resin fillers
- Resin substrates
- Narrow-gap applications