DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division

A type made by melting crushed silica rock at high temperature, and by producing spheres from the molten material by means of surface tension. Our technologies accumulated over many years enable us to meet customer requirements for varied particle distribution.

With its spherical shape, various advantages can be obtained, such as improved fluidity in resin filler applications, high content filling, and improved wear resistance, etc. In particular, we have accumulated many years of experience working on fillers for semiconductor sealing epoxy resins, and low uranium (low alpha) grades are also available for memory applications.

- Filler for Semiconductor sealants
- Various types of resin fillers
- Cosmetics
- Low-soda glass beads (silica beads)