DENKI KAGAKU KOGYO KABUSHIKI KAISHA Electronic Materials Division

In addition to conventional EMC applications, a coarse-particle cut-type is available as fillers for liquid sealants, such as underfill and globe tops, and as fillers for various types of resin substrates.

In the case of the coarse particle cut type, viscosity when used with liquid type resins can be kept low, enabling high content filling. Available cut points are 30, 20, 10, and 5 micrometer, and shapes can also be selected according to the use and resin type, i.e. fractured or spherical types (versatile, low uranium).

- Filler for liquid type sealants
- Various types of resin fillers
- Resin substrates
- Narrow-gap applications