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Home > Product Information > Electronic / electrical components > DENKA ALSINK

DENKA ALSINK
Metal matrix composite formed with aluminum and silicon carbide
2005/08/08 update
Outline
"DENKA ALSINK" is an aluminum-based composite (MMC) consisting of Al-SiC and ceramics, whose combined characteristics, like low thermal expansion, high thermal conductivity, high strength, lightweight, etc., make this an excellent material. Highly sought after as a substitute for ceramics and metal materials such as Al alloys, Cu/Mo alloys, etc.
Features
Al-SiC is the perfect material for thermal proofing measures, having a thermal expansion ratio close to that of alumina (Al2O3), and a thermal conductivity equivalent to that of aluminum nitride (AlN). Its physical properties can be adjusted by selecting the type and content ratio of ceramics. It is also effective as a structural member, offering high strength, and high rigidity, while still being lightweight.
Use
(1) Base plates for power modules requiring superior reliability, like IGBTs, diodes, etc. (heat sinks)
(2) Heat emission lid for semiconductor packages like CPUs, etc. (heat dispersers)
(3) Components for microwave devices like optical/telecommunications-related equipment, etc.
(4) Components for manufacturing equipment for semiconductors, liquid crystal panels, etc.
Contact Us
Department : Electronic Products Department
Section :
TEL : +81-3-5290-5542
FAX : +81-3-5290-5289
Inquiry Click Here
Products with thermal emission attributes
DENKA HITTPLATE
DENKA AN PLATE
DENKA ALSINK
DENKA THERMALLY CONDUCTIVE SHEET AND SPACER

     
 
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* DENKA reserves the right to change Product Information from time to time at its discretion and without notice.
 
     

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