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Elegrip Tape(2) |
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Back grind tape |
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2005/08/08 update |
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| Outline |
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This tape is used for grinding semiconductor wafers. In recent years, wafer needs such as thin grinding, high bump, etc. have diversified, and we continuously strive to provide customers with products that meet their needs hereafter as well. |
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| Features |
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(1) Few particles are given off, requiring no cleaning process.
(2) It has good tight-sealing performance with silicon wafers, and is thus effective against water while back grinding.
(3) It exhibits minimal deterioration over time in its adhesive power, thereby limiting the release of particles.
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| Use |
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* Ordinary pressure sensitive type: Silicon (Si), for thin grinding, for bump grinding, and others
* UV type: Silicon (Si), gallium arsenide, etc.
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| More Information |
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Physical properties data (PDF)
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| Contact Us |
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Tapes & Adhesives Department |
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| TEL |
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+81-3-5290-5318 |
| FAX |
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+81-3-5290-5306 |
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Inquiry Click Here |
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Nothing on this website will be deemed to create any express or implied warranty or obligation of DENKA with respect to the Product Information or its use, including, but not limited to, any warranty of merchantability, fitness for a particular purpose or infringement of any intellectual property rights. |
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Each user of Product Information and DENKA products assumes its own responsibility to properly determine the manner and suitability of use of Product Information and DENKA products in its own operations. The user should exercise proper care in considering Material Safety Data Sheet, Product Information and any other technical information provided by DENKA, including descriptions of use conditions, warnings and cautionary instructions. |
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DENKA reserves the right to change Product Information from time to time at its discretion and without notice. |
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