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Elegrip Tape(1) |
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Dicing tape |
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2005/08/08 update |
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| Outline |
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A tape used for dicing semiconductor wafers and various types of IC substrate. In response to the recent diversification and higher quality of cutting work, we provide products that meet customers' needs such as low chipping, with the emphasis on cut precision, and adhesiveness to hard-to-adhere surfaces, etc. |
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| Features |
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Various grades are available according to usage conditions and required characteristics, from liquid crystal driver ICs and low chipping prepared products, to hard-to-adhere sealing package substrates.
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| Use |
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* Ordinary pressure sensitive type: Silicon (Si), LT, crystal, etc.
* UV type: Silicon (Si), glass, crystal, package substrate, etc.
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| More Information |
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Physical properties data (PDF)
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| Contact Us |
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Tapes & Adhesives Department |
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| TEL |
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+81-3-5290-5318 |
| FAX |
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+81-3-5290-5306 |
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Inquiry Click Here |
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Nothing on this website will be deemed to create any express or implied warranty or obligation of DENKA with respect to the Product Information or its use, including, but not limited to, any warranty of merchantability, fitness for a particular purpose or infringement of any intellectual property rights. |
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Each user of Product Information and DENKA products assumes its own responsibility to properly determine the manner and suitability of use of Product Information and DENKA products in its own operations. The user should exercise proper care in considering Material Safety Data Sheet, Product Information and any other technical information provided by DENKA, including descriptions of use conditions, warnings and cautionary instructions. |
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DENKA reserves the right to change Product Information from time to time at its discretion and without notice. |
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